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Home / Jobs / Job Detail

Job Summary

  • Company

    Shanghai Institute of Microsystem and Information Technology Chinese Academy of Sciences​

  • Location

    Shanghai, China​

  • Job Type

    Full Time

  • Salary Range

    Negotiable

  • Number to Recruit

    1

  • Job Reference Code

    J2201142

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Sensor Module Integration Engineer

Shanghai Institute of Microsystem and Information Technology Chinese Academy of Sciences
Shanghai, China

About Company:

Shanghai Institute of Mircrosystem and Information Technology (SIMIT), Chinese Academy of Sciences (CAS), formerly known as Shanghai Institute of Metallurgy, was one of the earliest research institutes of Academia Sinica founded in1928. Since August 2001, the name has been changed to SIMIT according to its research fields and objectives. During the past 90 years, SIMIT always focuses on frontier of the metallic material science, and played a leading role in the scientific research. After the 1960s, SIMIT was again the first entity to have established the ultra-pure metal and III-V compound semiconductor materials research base, and first superconducting cable in China. Since 2004, SIMIT has developed a superconducting center dedicated to the fundamental research of superconducting material and electronics. Now the superconducting research center includes around 80 research staffs and 50 graduate students. The research field on superconductors has grown into one of the three major research field in SIMIT.
For further information of SIMIT, please visit our website: www.sim.ac.cn.


Job Details:

Responsibilities:

1、Responsible for the integration design and packaging process plan of MEMS chips and modules;
2、Responsible for the development and test evaluation of the reliability test scheme of the chip module;
3、Write scientific research papers and invention patents, participate in professional meetings, and assist the team in project application, conclusion and other related work.


Qualifications:

1、Master degree in microelectronics/ electronic information/ materials/ physics and other related majors;
2、Have knowledge of packaging integration process and key electronic materials, and understand the failure mechanism of chip and packaging reliability;
3、At least 3 years of mechanical drawing design or relevant experience, and experience in semiconductor device packaging and reliability projects is preferred;
4、Logically, good at communication, brave in innovation, good at English expression and writing, and have ability to write scientific and technological document.


Benefit:

Provide competitive remuneration.

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