QST Corporation is a leading sensor platform company engaged in the development and marketing of Innovative MEMS sensors and solutions to simplify advanced perception, measurement, and control in consumer, automotive, and industrial applications.
With headquarters in Shanghai, QST has global R&D and sales and support centers in China, Hong Kong, Taiwan, and the United States. The company is actively involved in R&D, with a broad sensor and solutions product line including magnetic sensors, accelerometers, pressure sensors, performance inertial-GNSS modules, 6-axis IMUs, intelligent sensors, light sensors, magnetic switches, encoders, and sensor modules.
The company was founded in September 2012 and has a robust IP portfolio, with over 83 patents issued. QST has strong investor backing and earlier this year completed a 350 million yuan B+ round of equity financing. Participating investors include Walden International, Xiaomi, Junyida Capital Management, Jiuyou Fund, Jiangsu Runcheng, Lingang Science Innovation Investment, New Alliance Capital, and GP Capital.

Job Details:

Responsibilities:

Responsibilities
•Be responsible for the test development of new products from inception through transfer to manufacturing;
•Own the software and hardware test development solutions for the final packaged part testing;
•Work closely with the design & process team to implement test modes;
•Test methodology for fault coverage optimization and delivery of robust test solutions to manufacturing;
•Be an integral part of the first silicon debug and characterization team as well as test support for the qualification of new products prior to releasing them to production ;
•Lead the documentation and the optimization of the test tools for transfer to manufacturing.
Requirements
•BS/MS in engineering or computer science with at least 5 years MEMS test working xperience
•10 years semiconductor industry experience on test software and hardware development;
•Experience with SPEA, Solidus Test System, Chroma CX or Teradyne J750 test systems;
•Hands-on test experience with automated wafer sort and final test equipment;
•Expert in C++ programing or equivalent;
•Experience related to testing of MEMS devices and analog mixed signal IC;

Qualifications:

Bechelor Degree Major in semiconductor, physics, chemistry, materials, electronics, etc.
10+ years of relevant experience

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